Extremely fine and soft polishing pad with an extra interface layer for pressure control and adjustment to the surface to be polished. Because of the softness of the foam, this pad can be compressed to as little as 3mm with minimum pressure. The harder orange foam interface layer enables holograms and micro-scratches to be polished out efficiently. The life of the pad is sustainably increased due to the innovative sandwich design.
Suitable for use with Dual Action and Rotary machines.
1 x 85mm pad